Method of forming a transistor having multiple channels

ABSTRACT

A transistor ( 10 ) overlies a substrate ( 12 ) and has a plurality of overlying channels ( 72, 74, 76 ) that are formed in a stacked arrangement. A continuous gate ( 60 ) material surrounds each of the channels. Each of the channels is coupled to source and drain electrodes (S/D) to provide increased channel surface area in a same area that a single channel structure is conventionally implemented. A vertical channel dimension between two regions of the gate ( 60 ) are controlled by a growth process as opposed to lithographical or spacer formation techniques. The gate is adjacent all sides of the multiple overlying channels. Each channel is formed by growth from a common seed layer and the source and drain electrodes and the channels are formed of a substantially homogenous crystal lattice.

RELATED APPLICATION

This application is related to U.S. patent application Ser. No.10/074,732, entitled “Method of Forming A Vertical Double GateSemiconductor Device And Structure Thereof” filed Feb. 13, 2002, andassigned to the assignee hereof.

FIELD OF THE INVENTION

This invention relates generally to semiconductors, and morespecifically, to the manufacture of and the structure of semiconductordevices.

BACKGROUND OF THE INVENTION

As semiconductor devices continue to become smaller in size, the devicesmust be what is known in the industry as “scalable”. That is, thedevices must continue to be able to be made with reduced dimensions andstill function at the required specifications. Traditionally, MOSFETshave been implemented with a single control electrode or gate on aplanar substrate. The gate is placed between a source and drainelectrode and functioned to create a channel for controlling the amountof current conducted by the MOSFET. Because there is a gate electrode tocontrol the channel only on one side of the channel, there is only asingle source of control of the channel. Single control of the channelleads to undesired leakage current (i.e. electron or hole flow) betweenthe source and drain when the transistor is intended to benon-conductive.

An improved structure that was proposed was the use of a two-gatetransistor with the gates on both sides of a thin silicon channel. Thisarrangement increases the electrostatic coupling between the gates andthe channel relative to the single gate device. As a result, the drivecurrent of the transistor is increased and the leakage current isdecreased. One type of transistor having two gates is known in the artas double gate or dual gate FinFETs, in which the channel consists of asingle pillar or slab (a fin) that is oriented perpendicular to theplane of a substrate for a given area overlying the substrate.Additional channel width for a transistor requires additional circuitarea to provide the additional channel width. For example, known planarMOSFETs and FINFETs having multiple channels are formed laterally andthus require significant additional area.

The effective channel width of a FinFET transistor is only on thesurface of a single silicon fin. The dimensions of the fin determine thecharacteristics of the device. It is desirable that the fin be thinnerthan the gate length in order to get good short channel control.However, lithographically or spacer defined dimensions do not offer asmuch manufacturing control as grown layers to form a transistor channel.

BRIEF DESCRIPTION OF THE DRAWINGS

The present invention is illustrated by way of example and is notlimited by the accompanying figures, in which like references indicatesimilar elements.

FIG. 1 illustrates in cross-sectional form initial layers of asemiconductor device in accordance with the present invention;

FIG. 2 illustrates in cross-sectional form further processing of thesemiconductor device of FIG. 1;

FIG. 3 illustrates in cross-sectional form a top view of thesemiconductor device of FIG.2;

FIG. 4 illustrates in cross-sectional form patterning of thesemiconductor device of FIG. 2;

FIG. 5 illustrates in cross-sectional form a first form of processing ofthe semiconductor device of FIG. 4;

FIGS. 6 and 7 illustrate in cross-sectional form an alternate form ofprocessing of the semiconductor device of FIG. 4;

FIG. 8 illustrates in cross-sectional form continuation of theprocessing of the semiconductor device of FIG. 5;

FIG. 9 illustrates in cross-sectional form continuation of theprocessing of the semiconductor device of FIG. 8 including the formationof multiple overlying channels;

FIG. 10 illustrates in perspective form the semiconductor deviceillustrated in FIG. 9;

FIG. 11 illustrates in cross-sectional form removal of a portion oflayers of the semiconductor device of FIG. 9; and

FIG. 12 illustrates in cross-sectional form completion of thesemiconductor device.

Skilled artisans appreciate that elements in the figures are illustratedfor simplicity and clarity and have not necessarily been drawn to scale.For example, the dimensions of some of the elements in the figures maybe exaggerated relative to other elements to help improve theunderstanding of the embodiments of the present invention.

DETAILED DESCRIPTION

Illustrated in FIG. 1 is a semiconductor device 10 having a substrate12. In one form the semiconductor device 10 is an FET (field effecttransistor). The substrate 12 may be formed of any type of material,either conductive, semi-conductive or insulative. In one form, substrate12 is single crystal silicon. Other forms of substrate 12 may includesilicon, silicon on insulator, silicon on sapphire, and silicon onnitride. An insulating layer 14 overlies the substrate 12. Insulatinglayer 14, in one form, is silicon dioxide. Overlying the insulatinglayer 14 is a semiconductor layer 16. In one form, semiconductor layer16 is silicon or silicon germanium, but other semiconductor materialsmay be used. For example, germanium, silicon germanium carbon, galliumarsenide, gallium nitride and indium phosphide are other appropriatematerial compositions.

In another form, the integrated circuit substrate 12 is asilicon-on-insulator (SOI) bonded wafer having a silicon layer whichfunctions as semiconductor layer 16. Overlying semiconductor layer 16 isa semiconductor layer 18. While semiconductor layer 18 may be formed ofany semiconductor material, one implementation of semiconductor layer 18is silicon germanium. In addition, semiconductor layer 18 should be ofthe same crystallinity as the material used for semiconductor layer 16but having differing etch properties (i.e. different etch rates). Aplurality of additional overlying semiconductor layers is formedoverlying semiconductor layer 18. In the illustrated form, semiconductorlayer 20, semiconductor layer 22 and semiconductor layer 24 are formed.While various materials may be implemented, semiconductor layers 16, 20and 24 should be formed of the same material in order to have a samefirst etch rate. Similarly, semiconductor layers 18 and 22 should beformed of the same material in order to have a same second etch rate.Typically, substrate 12, insulating layer 14 and semiconductor layer 16are formed as an SOI starting material. The creation thereof may bevary. For example, insulating layer 14 may be thermally grown ordeposited onto substrate 12 and bonded with semiconductor layer 16. Inone form, semiconductor layers 18, 20, 22 and 24 are formed by epitaxialgrowth. In other forms, semiconductor layers 18, 20, 22 and 24 may beformed using atomic layer deposition or molecular beam epitaxy. Thecompositions of silicon and silicon germanium and thicknesses thereofare controlled by the ambient gas flow, temperature and time in aconventional manner such as epitaxial growth. Typical thickness forthese layers varies between two hundred to four hundred Angstroms. Theillustrated thickness is not necessarily drawn to scale.

Illustrated in FIG. 2 is further processing of semiconductor device 10wherein a patterned layer 26 is formed over a predetermined portion ofsemiconductor layer 24. In one form, the patterned layer 26 is nitride.However, other materials that function as a protective barrier materialmay be used. Examples of other materials suitable for use as thepatterned layer 26 include, by way of example only, photoresist, oxide,and an organic anti-reflective coating (ARC).

Illustrated in FIG. 3 is a top view of the semiconductor device 10formed as in FIG. 2. From the top, patterned layer 26 has two endportions that are much wider than a connecting portion. The connectingportion forms a channel region and the two ends respectively form asource and a drain that respectively function as first and secondcurrent handling terminals, current handling electrodes or currentelectrodes. The source and drain are not doped (i.e. implanted) untillater steps after formation of the gate of the semiconductor device. Thewidth of the channel region is designated as “w”. Patterned layer 26 isformed over semiconductor layer 24. Patterned layer 26 functions as aprotective barrier to permit selective etching of the underlyingsemiconductor layers. To further correlate FIG. 3 with FIG. 2, across-sectional line in FIG. 3 illustrates the FIG. 2 view.

Illustrated in FIG. 4 is further processing of semiconductor device 10.As illustrated, the semiconductor layers 16, 18, 20, 22 and 24 areetched or removed from those areas not protected by the patterned layer26. The resulting structure exposes insulating layer 14 and leaves astack of semiconductor layers in which alternating layers are, in oneform, a same material with a same etch rate property. Instead of using asame material in alternating layers, the alternating layers have adifferent etch rate. Semiconductor layers 16, 20 and 24 have etch ratesthat differ from semiconductor layers 18 and 22. Another way of statingthis property is to consider the layers beginning with semiconductorlayers 16 and 18 as being odd and even layers, alternately, and so on asadditional semiconductor layers are added. Semiconductor layers in oddnumbered layers need only to have a different etch rate property thanthe layers in even numbered layers.

Illustrated in FIG. 5 is further processing of semiconductor device 10wherein an isotropic etch is performed by placing all of thesemiconductor device 10 in an etchant that is selective to etchingsemiconductor layers 18 and 22. In one form, the etchant is a mixture ofnitric acid, hydrogen peroxide and hydrofluoric acid. It should beunderstood that in another form the etching could be implemented byusing an etchant that is selective to semiconductor layers 16, 20 and24. Referring back to FIG. 3, the varying widths of patterned layer 26directly influences how the FIG. 5 semiconductor device 10 looks. Allexposed surfaces of semiconductor layers 18 and 22 are etched to someextent. The central region of patterned layer 26 has a width, w, that issignificantly smaller than the end regions thereof. The smaller widthcentral region allows the complete removal of semiconducting material ina central region of each of semiconductor layers 18 and 22 torespectively form cavities 30 and 32, respectively. Additional tocavities 30 and 32, the remaining exposed portions of semiconductorlayers 18 and 22 are also etched. At the edges, complete removal of thesemiconductor layers 18 and 22 forms notches 34, 36, 38 and 39. Becausethe etch that is performed created cavities 30 and 32, it is certainthat the amount of inward isotropic etching that occurs at the edges ofsemiconductor layers 18 and 22 is a length of at least w or greater.

Illustrated in FIG. 6 is an alternative embodiment of the patterned etchof semiconductor layers 18 and 22. In this form, an extra processingstep is required by the presence of notches 34, 36, 38 and 39 isavoided. A protective layer 28 is patterned overlying semiconductordevice 10. In particular, only a portion of the stack of semiconductorlayers is allowed to be exposed. This exposed area will form the channelregion of the semiconductor device 10. In one form the protective layer28 is implemented with silicon dioxide or a photoresist. Other materialsmay be used such as a nitride.

Illustrated in FIG. 7 is a later step in the alternative embodimentbegun in FIG. 6. An isotropic is performed by placing all of thesemiconductor device 10 in an etchant that is selective to etchingsemiconductor layers 18 and 22. It should be understood that in anotherform the etching could be implemented by using an etchant that isselective to semiconductor layers 16, 20 and 24. All exposed surfaces ofsemiconductor layers 18 and 22 are etched to some extent. The sides ofsemiconductor layers 18 and 22 directly underneath the opening inprotective layer 28 are exposed and etched all the way through torespectively form cavities 40 and 42, respectively. Because the etchgoes completely through the width, w, of the central portion ofpatterned layer 26, the amount of inward isotropic etching that occursat the edges of cavities 40 and 42 into semiconductor layers 18 and 22,respectively, is a lateral amount of at least one-half of w (w/2) orgreater since the etching of cavities 40 and 42 is occurring from twosides. It should however be apparent that due to effects such asloading, non-uniform etch rates between the central region and the edgeregions are possible thereby resulting in the edge etch dimension beingslightly less than (w/2). To conclude the selective etching ofsemiconductor layers 18 and 22, the protective layer 28 is removed.

Assume that the first form of the etching of semiconductor layers 18 and22 is implemented for discussion of further processing. Illustrated inFIG. 8 is the resulting structure from FIG. 5. In FIG. 8, a thindielectric or insulating layer is formed on all exposed surfaces of thesemiconductor layers 16, 18, 20 22 and 24. In particular, thin oxidelayers 50 and 52 are formed on the surfaces of cavities 40 and 42,respectively. Thin oxide layer 50 is formed on the left edges ofsemiconductor layers 16, 18, 20, 22 and 24 and thin oxide layer 56 isformed on the right edges of semiconductor layers 16, 18, 20, 22 and 24.It should be understood that when viewed in perspective form, the thinoxide layers 50, 52, 54 and 56 are a continuous single oxide layer.There will be minimal variation in the thickness of the oxide layer oversemiconductor layers of differing materials. The thin oxide layer withinthe cavities 40 and 42 functions as a gate dielectric. The thin oxidelayer will also function as an etch stop layer in a subsequentprocessing step described below. In one form, the oxide layer isthermally grown and is silicon dioxide. Other forms of the thin oxidelayer may be dielectrics that are deposited, such as oxides, metaloxides or oxy-nitrides.

Illustrated in FIG. 9 is further processing of semiconductor device 10wherein a gate electrode 60 and a masking (i.e. blocking) layer 80 aredeposited and patterned to form the illustrated gate. A gate is formedin multiple portions in different vertical layers as noted by thecross-hatching in FIG. 9. The multiple layers of the gate surround thechannel regions 72, 74 and 76 and form a vertical stack with respect toa horizontal reference coplanar with a top surface of the substrate 12.In other words, the channel regions 72, 74 and 76 are physicallyseparated at least by portions of a control terminal material used toform gate electrode 60. In one form, gate electrode 60 is either a metalor polysilicon, either in doped or undoped form. Due to the conformalnature of the deposition of polysilicon, the gate electrode forms ineach of cavities 40 and 42 and is removed (i.e. etched) conformal to thedesired pattern location and etch rate. The etch results in formercavity 40 having an edge cavity 78 and an edge cavity 79. Similarly,former cavity 42 has an edge cavity 81 and an edge cavity 83. These edgecavities are desired and function as spacers isolating the source anddrain regions from the gate and will be filled with insulating spacermaterial to be described below. To the left of the gate electrode 60 isa source or drain region designated as “S/D” and to the right of thegate electrode 60 is a drain or source region designated as “D/S” thatfunction as current handling terminals. Each current handling terminalhas a width that is substantially equal to a first value. Each of thechannel regions 72, 74 and 76 has a width that is substantially equal toa second value wherein the first value is greater than the second value.At this point in the processing, these source and drain regions aredoped with an ion implantation. An N type implant is performed for anNMOS transistor and a P type implant is performed for a PMOS transistor.Masking layer 80 and gate electrode 60 function as blocking layers toprevent the implant from entering the channel regions. It should benoted that a transistor has been formed having multiple channels thatare compact and vertically aligned in overlying fashion. The channeldimensions between the various portions of gate electrode 60 may beformed with extremely fine precision because the channels are grown inthe vertical direction. This is a very important feature. In multiplegate transistors, the ability to control the dimensions of thetransistor channel control other electrical parameters such as leakagecurrent and short channel effects.

At this point, an integrated circuit having a transistor with source,drain and gate electrodes has been formed. The transistor has multipleoverlying channel regions formed under or between multiple gate layers.The gate layers are a common material and are represented by thecross-hatched regions, such as the region of gate electrode 60. The gateelectrode 60 functions as a control terminal and is shaped to fully looparound channel regions 72, 74 and 76. Alternating layers of thesemiconductor layers, such as semiconductor layers 16, 20 and 24 containa channel region connected to the source and drain on either end. Thesource and drain have a different conductivity than the channel as aresult of source/drain implants. It should be noted that thesource/drain that is formed by the ion implantation of semiconductorlayers 16, 18, 20, 22 and 24 is formed of a substantially homogenouscrystal lattice to have homogenous crystallinity. Similarly, theplurality of channels formed by channel regions 72, 74 and 76 is alsoformed of a substantially homogenous crystal lattice to have homogenouscrystallinity.

Illustrated in FIG. 10 is a perspective view of the semiconductor device10 of FIG. 9. For convenience of illustration, the same elements arenumbered identically. Again, it should be noted that the shape of thesource and drain columns may vary. Although the original shape may beginas a straight-edge structure, the various etching steps tend to round orsmooth the source and drain regions resulting in the circular forms. Allof the semiconductor layers 18, 20, 22 and 24 are grown from the sameseed layer, semiconductor layer 16. This provides substantiallymonocrystalline channels. Monocrystalline silicon provides bettertransistor characteristics (e.g. mobility, dopant activation and oxidequality) than polycrystalline or amorphous silicon. Any number ofsemiconductor layers may be implemented. Additional semiconductor layerscreate further channel surface area and thus increased transistor drivecapability. This additional drive capability is provided withoutincreasing lateral transistor area and is therefore a very compact andsize efficient transistor. While the cross-sectional views of theprevious illustrations do not lend themselves to show how the gateelectrode 60 loops around channel region 74 and channel region 76, it isclear from the perspective view of FIG. 10 that the gate electrode goesthrough former cavities 40 and 42 to form a loop around channel region74 and channel region 76. Channel region 72, the lowest or bottom-mostchannel region has only overlying gate electrode material. It should benoted that the transistor embodied by semiconductor device 10 may beimplemented with a plurality of channels, such as channel 16 and channel20, that vary in thickness and have different thickness rather than auniform thickness. Since the structure is a stack structure, the variouslayers can readily be formed with differing thickness. Further, theseparation distance between any two of the plurality of channels may bedifferent. In other words, semiconductor layer 18 may be implementedwith a thickness that is different than the thickness of semiconductorlayer 22. In this form, at least two of the plurality of channels areseparated from an adjacent channel by a different amount. Thevariability in thickness provides flexibility in adjusting the desiredtransistor characteristics. Additionally, it should be understood thatin the FIG. 10 perspective, the gate electrode 60 extends symmetricallyfrom the other side of the transistor that is not visible from the view.In other words, gate electrode 60 is symmetric and extends away from thechannel region a predetermined desired amount.

Illustrated in FIG. 11 is a cross-sectional view of semiconductor deviceafter yet further processing from the structure of FIG. 9. A spacer 84is formed which isolates the gate from the source and drain. At thispoint part or all of semiconductor layers 18 and 22 are removed by anisotropic etch. If semiconductor layers 18 and 22 are formed of silicongermanium, it may be desirable to remove these layers and re-growsilicon in its place. This step is application specific. In someapplications it is desired to remove silicon germanium because thecomposition may result in a germanicide and silicides on silicon havelower resistivity than germanicides. In other applications, dopantactivation properties of germanium may be desirable and therefore thepresence of silicon germanium is desired. This etch also removes thethin oxide layers 52 and 56. The semiconductor layers 20 and 24 aresuspended at the sides but anchored by the gate and channel structure.

Illustrated in FIG. 12 is a cross-sectional view of semiconductor device10 wherein additional semiconductor region 96 is selectively grown,usually epitaxially, on all exposed silicon or silicon germaniumregions. Semiconductor region 96 functions to reduce the resistance ofthe source and drain regions of the transistor formed by semiconductordevice 10. Semiconductor region 96 also functions as a continuouscontact region to the source and drain of the structure. It should beunderstood that further conventional processing may be implemented suchas additional source/drain implanting, thermal activation, salicidationof the source, drain and gate regions and contact structure formationand metal interconnect.

By now it should be appreciated that there has been provided a fieldeffect transistor in an integrated circuit and method of formation thathas multiple channel regions that are overlying in an efficient verticalstack structure. The transistor has multiple layers of silicon and gateelectrodes and gate dielectric in the channel region. Channel region isincreased for a given layout area as compared with conventional multiplechannel or multiple fin transistor structures. The increased channelarea increases the current drive of the transistor and the control ofthe channel dimensions contribute to better short channel performanceand manufacturability of the transistor. In one form, an integratedcircuit has a substrate and an overlying transistor. The structurestaught herein provide an efficient method to control the channeldimensions. Further the separation distance between portions of a samechannel may vary and the separation distance between channels ofdiffering transistors may be different or the same depending upon thespecific desired application. The transistor has a first channeloverlying the substrate, a first portion of a control or gate electrodeoverlying the first channel, a second channel overlying the firstportion of the gate electrode and a second portion of the gate electrodeoverlying the second channel and connected to the first portion of thegate electrode. A first current handling electrode is connected to thefirst channel and the second channel. A second current handlingelectrode is connected to the first channel and the second channel. Themethod of fabricating a vertical multiple-channel FET device provides anintegrated circuit substrate. At least two layers having a firstcomposition with a first etch property overlie the substrate. At leastone layer of a second composition having a second etch property alsooverlie the substrate and alternate with the at least two layers of thefirst composition. The at least two layers of the first composition andthe at least one layer of the second composition are formed to have asubstantially homogenous crystallinity. A blocking layer is formed overthe at least two layers of the first composition and the at least onelayer of the second composition. The blocking layer is patterned todefine placement of a first current electrode region, a second currentelectrode region and a plurality of channels. Exposed portions of the atleast two layers of the first composition and the at least one layer ofthe second composition are etched to form the first current electroderegion, the second current electrode region and channel regionsextending from the integrated circuit substrate. The at least one layerof the second composition is further etched to remove said at least onelayer of the second composition and to form the plurality of channels ofthe first composition and located above and below any removed portion ofthe at least one layer of the second composition. A control electrodedielectric is deposited around each of the plurality of channels.Control electrode material is deposited around the control electrodedielectric. The control electrode material is selectively masked andetched to form a control electrode on top, bottom and sidewall surfacesof at least one of the plurality of channels. A spacer is formed toisolate the control electrode material from the first current electroderegion and the second current electrode region.

Although the method and structure taught herein has been disclosed withrespect to certain specific steps and materials, it should be readilyapparent that various alternatives may be used. Source and drainelectrodes may be used with polysilicon material instead ofsubstantially monocrystaline silicon. Gate dielectrics other thansilicon dioxide may be used. The height of the gate structure, includingspecific component elements, may be varied significantly. The gatelength may be varied depending upon the specific channel length desiredfor an application. The gate material may be polysilicon that is insitudoped or implanted, polysilicon germanium or metals such as titaniumnitride, tantalum silicon nitride or silicides such as nickel or cobaltsilicides or combinations therein. Although the width of the source anddrain is illustrated to be greater than the width of each of thechannels, the widths could be substantially the same.

Benefits, other advantages, and solutions to problems have beendescribed above with regard to specific embodiments. However, thebenefits, advantages, solutions to problems, and any element(s) that maycause any benefit, advantage, or solution to occur or become morepronounced are not to be construed as a critical, required, or essentialfeature or element of any or all the claims. As used herein, the terms“comprises,” “comprising,” or any other variation thereof, are intendedto cover a non-exclusive inclusion, such that a process, method,article, or apparatus that comprises a list of elements does not includeonly those elements but may include other elements not expressly listedor inherent to such process, method, article, or apparatus.

1. A method of fabricating a vertical multiple-channel FET devicecomprising: providing an integrated circuit substrate; providing atleast two layers of a first composition having a first etch property;providing at least one layer of a second composition having a secondetch property, wherein the at least two layers of the first compositionand the at least one layer of the second composition are formed to havea substantially homogenous crystallinity and wherein the at least twolayers of the first composition are separated by the at least one layerof the second composition; forming a blocking layer over the at leasttwo layers of the first composition and the at least one layer of thesecond composition; patterning the blocking layer to define placement ofa first current electrode region, a second current electrode region anda plurality of channels; etching exposed portions of the at least twolayers of the first composition and the at least one layer of the secondcomposition to form the first current electrode region, the secondcurrent electrode region and channel regions extending from theintegrated circuit substrate; further etching the at least one layer ofthe second composition to remove said at least one layer of the secondcomposition and form the plurality of channels comprised of the firstcomposition and located above and below any removed portion of the atleast one layer of the second composition; depositing a controlelectrode dielectric around each of the plurality of channels;depositing control electrode material around the control electrodedielectric; selectively masking and etching the control electrodematerial to form a control electrode on top, bottom and sidewallsurfaces of at least one of the plurality of channels; and forming aspacer to isolate the control electrode material from the first currentelectrode region and the second current electrode region.
 2. The methodof claim 1 wherein providing the at least two layers of a firstcomposition having a first etch property comprises forming the at leasttwo layers of the first composition by epitaxially growing the at leasttwo layers of the first composition.
 3. The method of claim 1 furthercomprising: forming additional material overlying areas adjacent thecontrol electrode and the spacer to reduce resistance of the firstcurrent electrode region and the second current electrode region of thevertical multiple-channel FET device.
 4. The method of claim 1 furthercomprising: etching the at least one layer of the second composition atthe first current electrode region and the second current electroderegion; and forming additional material at areas not covered by thecontrol electrode and the spacer to reduce resistance of the firstcurrent electrode region and the second current electrode region of thevertical multiple-channel FET device.
 5. The method of claim 1 furthercomprising selecting composition of the integrated circuit substrate tobe one of the group consisting of silicon, silicon on insulator, siliconon sapphire, and silicon on nitride.
 6. The method of claim 1 furthercomprising forming the integrated circuit substrate as a plurality oflayers, one of the plurality of layers of the integrated circuitsubstrate having the first composition.
 7. The method of claim 1 furthercomprising providing the integrated circuit substrate as asilicon-on-insulator (SOI) bonded wafer having a silicon layer whichfunctions as one of the at least two layers of the first composition. 8.The method of claim 1 further comprising providing the at least twolayers of a first composition and the at least one layer of a secondcomposition by using at least one of the group of processes consistingof epitaxial growth, atomic layer deposition, and molecular beamepitaxy.
 9. The method of claim 1 further comprising selecting the firstcomposition from one of the group consisting of silicon, germanium,silicon germanium and silicon germanium carbon and selecting the secondcomposition from one of silicon, germanium, silicon germanium andsilicon germanium carbon.
 10. The method of claim 1 further comprisingselecting the first composition from one of the group consisting ofgallium arsenide, gallium nitride and indium phosphide, and selectingthe second composition from one of the group consisting of galliumarsenide, gallium nitride and indium phosphide.
 11. The method of claim1 further comprising forming the blocking layer from one of the groupconsisting of photoresist, nitride, oxide, and organic anti-reflectivecoating.
 12. The method of claim 1 wherein the further etching of the atleast one layer of the second composition to remove said at least onelayer of the second composition and form the plurality of channelsfurther comprises etching to create a height of each of the plurality ofchannels to be less than a length of the control electrode.
 13. Themethod of claim 1 further comprising: blocking the control electrode byusing a blocking layer before etching the at least one layer of thesecond composition to remove the at least one layer of the secondcomposition at least at the plurality of channels.